Rayming Rigid flex PCB capabilities: Rigid Board: Up to 20 layer ( accept buried or blind hole design) Flex Board: 8 Layer ( Accept PI,Aluminum, Fr4 stiffener, and other special materials requirement ） Estimate Cost Now, Pls send PCB file to 3mgps@163.com, We will quote you Very Soon !
Rigid flex pcb capabilities and manufacturing process step by step
Preparing the Base Material
Before you start the fabrication process, clean the laminate thoroughly. This is important since the use of the copper coils feature anti-tarnish features.
First, immerse the copper coil into an acidic solution. Also, you can spray the copper coils with acid, if this is preferable. After, you micro-etch the coils. To make this happen, use sodium persulphate in treating the copper coil.
Third, is coating the coil in a comprehensive manner. You achieve this by making use of different oxidation agents.
Generating the Circuit Pattern
Here you will be creating the circuit pattern. Here, you will be using two major techniques, which are photo imaging and screen printing.
Photo Imaging: This technique, those the oldest, is still a frequently used method. This technique makes sure that the dry photoresist film rests on the laminate. You then expose the material to ultraviolet light. Furthermore, you can transfer the photomask pattern to the laminate.
Screen Printing: This is a preferable method because it can produce the right circuit patterns. This is possible because it can deposit on the surface of the laminate accurately.
Circuit Pattern Etching
Rigid flex PCBs manufacturers make this happen when you dip the laminate inside an etch bath. Another method you can use is to spray them making use of the right etchant solution. To get the necessary results, you can do etching on the two sides simultaneously.
Drilling
For drilling, the vias, pads, and holes are drilled. In order to have precise holes, make sure that your drilling tools have the ability to sustain a high speed. Make use of the methods of laser drilling when creating ultra-small holes.
Through-hole Plating
You must handle this step with much precision and care. After drilling the desired hole, you deposit copper into them. By doing this, they are chemically plated. Finally the result is forming of the electrical interconnections through the layers.
Applying the Covercoat or Cover Lay
Next is to apply the Covercoat or cover lay. This is to help you protect the flex circuit’s top and bottom sides. This protection is from all hostile environments including solvents and harsh chemicals.
